Skip to main navigation
Skip to main content
Home

Search form

  • About Everspin
  • Investors
  • Careers
  • Press
  • Sales Login
  • Products
    • Toggle MRAM

      • Toggle MRAM Technology
      • Parallel Products
      • Serial Products
      • FRAM-nvSRAM-SRAM Cross Reference Guide

      Spin-transfer Torque MRAM

      • Spin-transfer Torque MRAM Technology
      • ST-DDR Products for Data Centers
      • xSPI Products for Industrial IoT and Embedded

      Custom MRAM Capabilities

      • Radiation Hard Products
      • Custom Manufacturing
      • Everspin Intellectual Property
  • Applications & Case Studies
    • Applications & Case Studies

      • Aerospace
      • Automotive
      • Storage Solutions
      • Factory Automation
      • Internet of Things
      • Smart Energy
      • Medical
      • RAID
      • Industrial
  • Quality & Reliability
    • Quality Program

      • Quality Policy
      • ISO Certifications
      • RoHS/REACH
      • EICC / GeSI and Other Docs
      • Product Discontinuance Policy

      By Request

      • Qualification Reports
      • Reliability Reports
      • IPC1752 Documents
      • QC Flow Documents

      Submit Document Request

      Technical Papers Published by Everspin

      Browse Technical Papers

  • Buy or Sample
    • Contact Sales

      • United States, Canada & Mexico
      • Asia Pacific
      • South America
      • Japan
      • Europe, Middle East & Africa

      Buy Now from Worldwide Distributors

      • Arrow
      • DigiKey
      • Future
      • Mouser
      • Die Sales

      Request a Sample or More Information

      Request a Sample

      Product Inquiry

  • Support
      • Representatives and Distributors Worldwide
      • General Information Request
      • Documentation Search
      • Application Notes
      • Partners
      • Frequently Asked Questions
      • Contact Everspin
  1. Home
  2. Investor Relations
  3.  
  4. Everspin to Provide Industry Insights on Automotive & Chiplet Panels at Flash Memory Summit

Everspin to Provide Industry Insights on Automotive and Chiplet Panels at Flash Memory Summit

Investor Relations

    • Overview
    • News
    • Events & Webcasts
    • Investor Presentation
    • Financial Information
      • Annual Reports
      • Quarterly Results
      • SEC Filings
    • Stock Information
      • Analyst Coverage
    • Corporate Governance
      • Management
      • Board of Directors
      • Board Diversity Matrix
      • Governance Documents
      • Committee Composition
    • Contact Investor Relations
      • E-mail Alerts

Everspin Press Releases

View printer-friendly version << Back
Everspin to Provide Industry Insights on Automotive and Chiplet Panels at Flash Memory Summit

Senior Director of Marketing, Joe O’Hare, to serve as expert panel member

CHANDLER, Ariz.--(BUSINESS WIRE)--Aug. 3, 2023-- Everspin Technologies, Inc. (NASDAQ:MRAM), the world’s leading developer and manufacturer of Magnetoresistive Random Access Memory (MRAM) non-volatile solutions, has announced Senior Director of Marketing, Joe O’Hare, will present at the Flash Memory Summit as part of the Automotive Panel Part 1 (Applications Track) on Tuesday, August 8 from 8:30-9:35 AM.

The Flash Memory Summit brings together industry leaders and startups across all forms of high-performance energy, including NAND Flash, DRAM, MRAM, ReRAM, and DNA data storage to discuss design, development, integration, marketing strategy and use cases. In his presentation, O’Hare will discuss trends for automotive SSDs, including implementing new architecture and technologies to support the evolution toward autonomous vehicles.

The panel will cover key features for the future, including the use of SRIOV by SSDs to create a centralized/zonal architecture that saves costs and improves the overall design. Additionally, O’Hare will weigh in on how securing and protecting critical data stored is crucial for the safety of vehicles and how implementing MRAM and other persistent memory features will ensure reliable and trustworthy performance even in challenging conditions. Other panelists include Roger Melen of Toyota Research, Steve Shih of Silicon Motion and Adrian Cosoroaba of Winbond, with Greg Basich of Technology Insights moderating.

In addition, O’Hare was selected to serve on the “What is the Difference Between a Memory Chip and a Memory Chiplet” panel, which will cover how emerging memory technology developers can create a market for products. Panelists will explore the differences between standalone memory chips and memory chiplets and how different interfaces may affect their architectures. Panelists also include Danny Sabour of Avalanche Technology, Balint Fleisher of Near Data Computing and Micron Technology, Debendra Das Sharma of Intel and UCle Consortium chairman and the organizer/moderator will be Charles Sobey of ChannelScience.

“There is a growing demand for high-performance, persistent memory technology and as the market’s leading expert in MRAM, Everspin has keen insights and intelligence about what this means for the automotive industry and what is on the global horizon,” said O’Hare.

Everspin’s presence at FMS includes O’Hare participating in a “Chat with the Experts” event on Tuesday, August 8, from 7:30-9:30 PM. The event allows attendees to meet one-on-one with many experts within the flash memory industry.

To register to attend visit: https://flash-memory.omnievent.com/2023/step-1-prelim

About Everspin Technologies

Everspin Technologies, Inc. is the world’s leading provider of Magnetoresistive RAM (MRAM). Everspin MRAM delivers the industry’s most robust, highest performance non-volatile memory for Industrial IoT, Data Center, Automotive, and other mission-critical applications where data persistence is paramount. Headquartered in Chandler, Arizona, Everspin provides commercially available MRAM solutions to a large and diverse customer base. For more information, visit www.everspin.com. NASDAQ: MRAM.

About Flash Memory Summit

Flash Memory Summit, produced by Conference ConCepts, showcases mainstream applications, key technologies, leading vendors, and innovative startups driving the multi-billion-dollar high-speed memory and SSD markets. FMS is now the world's largest event featuring trends, innovations, and influencers driving adoption of flash memory and other high-speed memory technologies within demanding enterprise storage applications, high-performance computing, mobile, and embedded systems. 2023 Flash Memory Summit is on August 8-10, 2023, at the Santa Clara Convention Center in Santa Clara, Calif.

View source version on businesswire.com: https://www.businesswire.com/news/home/20230803566246/en/

Agency Media Contact:
Shannon Blood
T: 208.216.9180
E: sblood@kiterocket.com

Source: Everspin Technologies, Inc.

    Shareholder Tools

    • Print Page
    • RSS
    • E-mail Alerts

Everspin Social Media

Follow Everspin on Twitter

Engage with Everspin on LinkedIn

Provide Feedback

Please let us know what we can improve

Contact Us

  • Find a Sales Representative
  • General Inquiry
  • Request a Sample

Investor Relations

Information for current and prospective investors

Copyright © 2015-2026 Everspin Technologies Inc.